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Fabrication, Densification, and Replica Molding of 3D Carbon Nanotube Microstructures
Published on: July 2, 2012
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Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN
Amir Mirza Gheitaghy1, René H Poelma1, Leandro Sacco1
1Department of Microelectronics, Delft University of Technology, Feldmannweg 17, 2628CT Delft, The Netherlands.
Nanomaterials (Basel, Switzerland)
|June 24, 2020
Summary
This study investigated coated carbon nanotube pillars for quantum computing. Coating enhanced mechanical properties, improving superconducting vertical interconnects for reliable operation.
Area of Science:
- Materials Science
- Nanotechnology
- Quantum Computing
Background:
- Vertically-aligned multi-walled carbon nanotube (VA-MWCNT) pillars are crucial for advanced electronic applications.
- Developing reliable superconducting vertical interconnects is essential for quantum computing.
Purpose of the Study:
- To investigate the compressive stress of pristine and coated VA-MWCNT pillars.
- To evaluate the mechanical enhancement of VA-MWCNT pillars via conformal niobium-titanium-nitride coating.
- To assess the potential for superconductive vertical interconnects in quantum computing.
Main Methods:
- Flat-punch nano-indentation was used to test VA-MWCNT pillars (30-150 µm diameter).
- Atomic layer deposition (ALD) was employed to apply a conformal niobium-titanium-nitride coating.
- Mechanical properties (compressive strength, elastic modulus) were analyzed for pristine and coated pillars.
Main Results:
- Pristine CNTs exhibited foam-like behavior with three compressive stress regimes.
- Coated CNTs showed ceramic-like fracture, with enhanced elastic modulus dependent on pillar diameter and coating diffusion.
- Smaller pristine pillar diameters increased elastic modulus; larger coated pillar diameters increased elastic modulus due to sidewall area.
Conclusions:
- Conformal coating significantly enhances the mechanical performance of VA-MWCNT pillars.
- Coated pillars offer improved reliability for superconducting vertical interconnect access (via).
- These findings support the development of high-density superconducting interconnects for quantum computing applications.
