Adhesion layer-free attachment of gold on silicon wafer and its application in localized surface plasmon...

The use of a metallic adhesion layer between plasmonic-active nanostructures and a solid supported is known to dampen the plasmonic response. To overcome this problem, organic adhesion layers have been introduced, which in turn can undermine the stability of the film. Moreover, both types of layers limit the regeneration of the nanostructures for multiple uses. Here we report a quick and simple approach to prepare intermediate adhesion layer-free binding of nanostructured films of gold on silicon wafers. The approach involves scratching and etching of the silicon wafer before sputter coating with a thin layer of Au. The plasmonic-active nanostructures were then prepared on this thin Au film using electrochemical deposition. As-prepared plasmonic-active nanostructured thin films of gold (PANTF-Au) are easy to handle, physically robust, and can be regenerated. The bulk refractive index sensitivity of PANTF-Au is 150 nm/RIU with the figure of merit 1.4, and with a plasmonic field-decay length of 27 nm. We further used these thin films to study interactions between lectin and glycoprotein inside a flow cell as well as on a microplate made of PANTF-Au. The PANTF-Au can be easily integrated with electrochemical devices and microfluidics, which can help to pave the way toward the development of ideal optical-electrochemical point-of-care biosensors.