Ultra-compact high efficiency and low crosstalk optical interconnection structures based on inverse designed...

Area of Science:

• Photonics and Optical Engineering
• Integrated Optics
• Nanophotonics

Background:

• On-chip optical interconnections are crucial for high-performance computing and data communication.
• Existing devices often face limitations in size, efficiency, and crosstalk, hindering further integration.
• Silicon-on-insulator (SOI) platform offers a robust foundation for integrated photonic devices.

Purpose of the Study:

• To design and demonstrate ultra-compact, high-efficiency, low-crosstalk optical interconnection devices.
• To explore the application of inverse design and direct binary search algorithms in photonic device optimization.
• To validate the performance of these devices for on-chip optical networks.

Main Methods:

• Utilized inverse design principles combined with a direct binary search algorithm for device optimization.
• Designed a 90-degree waveguide bend, a standard waveguide crossing, and a same-direction waveguide crossing.
• Simulated device performance across the 1,400-1,600 nm wavelength range using the SOI platform.

Main Results:

• Achieved a 90-degree waveguide bend with a 2.4 × 2.4 μm² footprint and 0.18 dB transmission loss.
• Designed a waveguide crossing (2.4 × 2.4 μm²) with < 0.5 dB insertion loss and < -19 dB crosstalk.
• Developed a same-direction waveguide crossing (2.4 × 3.6 μm²) with < 0.56 dB insertion loss and < -21 dB crosstalk.
• Demonstrated high performance in integrated optical interconnect structures formed by these basic devices.

Conclusions:

• The developed ultra-compact devices significantly enhance optical interconnection performance on a chip.
• The inverse design and direct binary search approach is effective for optimizing integrated photonic devices.
• These advancements pave the way for higher integration density in optical interconnects.