Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips.

Area of Science:

• Electrical Engineering
• Power Electronics
• Sensor Technology

Background:

• Press-pack insulated gate bipolar transistors (IGBTs) are crucial for direct current (DC) transmission.
• Uneven current distribution in parallel boss chips of press-pack IGBTs (PPIs) compromises device reliability.
• Accurate measurement of individual chip currents is essential for PPI performance monitoring.

Purpose of the Study:

• To design and validate a novel sensor for measuring individual chip currents in PPIs.
• To address the challenge of uneven current distribution affecting PPI reliability.
• To develop a high-performance Rogowski coil sensor with enhanced anti-interference and sensitivity.

Main Methods:

• Analysis of Rogowski coil principles and equivalent models.
• Design of a multi-layer printed circuit board (PCB) Rogowski coil using Altium Designer and ANSYS for simulation.
• Integration of a composite integrator to create the final sensor.
• Validation through Pspice simulation and experimental testing.

Main Results:

• A 1 mm thick, 76-turn integrated four-layer PCB Rogowski coil was successfully designed.
• The integrated Rogowski coil sensor demonstrated excellent high-frequency performance, anti-interference, and sensitivity.
• Simulation and experimental results confirmed the sensor's capability to accurately measure PPI chip currents.

Conclusions:

• The developed integrated Rogowski coil sensor effectively measures individual chip currents in PPIs.
• This sensor contributes to improving the reliability and performance monitoring of DC transmission systems.
• The multi-layer PCB Rogowski coil design offers a robust solution for current measurement in power electronic devices.