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Updated: Dec 13, 2025

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Metallic glass coating for improving diamond dicing performance.

Jinn P Chu1,2, Bo-Zhang Lai3, Pakman Yiu3,4

  • 1Department of Materials Science and Engineering, National Taiwan University of Science and Technology, Taipei, 10607, Taiwan. jpchu@mail.ntust.edu.tw.

Scientific Reports
|July 26, 2020
PubMed
Summary

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This summary is machine-generated.

Metallic glass (MG) coatings on diamond dicing blades significantly reduce chipping in materials like silicon and sapphire. This innovative coating lowers friction, enhancing dicing consistency and blade lifespan.

Area of Science:

  • Materials Science
  • Surface Engineering
  • Mechanical Engineering

Background:

  • Chipping in diamond dicing blades is a significant issue affecting substrate quality and tool longevity.
  • Existing dicing methods struggle with materials like silicon carbide, sapphire, and patterned sapphire substrates due to their hardness.

Purpose of the Study:

  • To investigate the efficacy of metallic glass (MG) coatings on diamond dicing blades for reducing chipping.
  • To evaluate the performance of these coated blades on various hard substrates including Si, SiC, sapphire, and PSS.

Main Methods:

  • Application of Zr-based metallic glass coatings onto diamond dicing blades.
  • Experimental dicing of Si, SiC, sapphire, and PSS using both bare and coated blades.
  • Analysis of chipping area, size, kerf variations, and finite-element modeling of stress and deformation.

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Main Results:

  • MG-coated blades demonstrated reduced chipping area across all tested substrates: Si (~23%), SiC (~36%), sapphire (~45%), and PSS (~33%).
  • A notable reduction in large chips (> 41 µm width) was observed, particularly for sapphire (~80%).
  • Finite-element modeling indicated lower tensile stress and elastic-plastic deformation due to the coating's low coefficient of friction (CoF).

Conclusions:

  • Metallic glass coatings effectively minimize chipping during the dicing of hard materials.
  • The low CoF of MG coatings enhances dicing performance, consistency, and blade durability.
  • This technology offers a promising solution for improving semiconductor and substrate processing.