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Updated: Dec 13, 2025

The Effect of Anodization Parameters on the Aluminum Oxide Dielectric Layer of Thin-Film Transistors
Published on: May 24, 2020
Defect spectroscopy on the dielectric material aluminum oxide
Dennis Oing1, Martin Geller2, Lucas Stahl2
1Department of Physics and CENIDE, University Duisburg-Essen, Lotharstr. 1, 47057, Duisburg, Germany. dennis.oing@uni-due.de.
Abstract:
A method for defect characterization is presented that allows to measure the activation energy, capture cross-section, and defect density in dielectric materials. This is exemplarily performed on aluminum oxide thin films deposited on hydrogen-terminated diamond. During the measurement, samples were illuminated using a 405 nm laser, charging the defects while simultaneously measuring the surface conductivity of the diamond at different temperatures. By applying the standard boxcar evaluation known from deep-level transient spectroscopy, we found five different defect levels in [Formula: see text]. One can be identified as substitutional silicon in aluminum oxide, while the others are most likely connected to either aluminum interstitials or carbon and nitrogen impurities.

