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Updated: Dec 13, 2025

A Fabrication and Measurement Method for a Flexible Ferroelectric Element Based on Van Der Waals Heteroepitaxy
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Dependence of RF/Analog and Linearity Figure of Merits on Temperature in Ferroelectric FinFET: A Simulation Study
Abstract:
This article presents a simulation study of the impact of variation in temperature on the transfer characteristics and the RF/analog performance like transconductance ( gm ), gate capacitance ( Cgg ), cutoff frequency ( ft ), and transconductance frequency product (TFP) of the ferroelectric FinFET (Fe-FinFET). In addition, the impact of temperature on the linearity parameters such as higher order harmonics ( gm2 and gm3 ), second- and third-order voltage intercept points (VIP2 and VIP3), third-order power-intercept point (IIP3), third-order intermodulation distortion (IMD3), and 1-dB compression point is estimated for wide variation of temperature in the Fe-FinFET. It is seen that temperature has a significant impact on the RF/analog and linearity parameters, and these figure of merits (FoMs) are the functions of temperature. Analysis reports that RF/analog parameters are suppressed, whereas the linearity FoMs are improved as temperature changed from 250 to 350 K.
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