Microstructured SiO/COP Stamps for Patterning TiO₂ on Polymer Substrates via Microcontact Printing

Microcontact printing (μCP) techniques have sparked a surge of interests in microfabrication since they help produce arrays on a wide range of target substrates in a facile and efficient manner. Polydimethylsiloxane (PDMS), as a well-established material for stamps, has constraints resulting from its hydrophobicity and softness, and the replication of PDMS stamps usually requires rigid masters or processes using a photoresist. Herein, a novel μCP stamp based on cyclo-olefin polymer (COP) is produced through vacuum ultraviolet (VUV) lithography. 2,4,6,8-Tetramethylcyclotetrasiloxane is selectively deposited at the affinity-patterns on the COP surface, and these patterned siloxane films are converted into SiO meanwhile protecting the COP beneath them from the VUV photoetching. By this means, a patterned relief is fabricated on the COP plates, resulting in a hydrophilic SiO/COP μCP stamp with punch heights of ∼180 nm. The novelty arises from the simplicity of the master- and photoresist-free microstructuring, and the higher stiffness of SiO/COP stamps prevents the deformation during pressing. Finally, an example μCP is given to transfer titania precursor gel and produce TiO₂ micropatterns on flexible polymer substrates. The SiO/COP stamps and the μCP of TiO₂ provide simple and cost-effective patterning techniques, which should contribute to the future design and creation of flexible devices.