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Soft Lithographic Functionalization and Patterning Oxide-free Silicon and Germanium
Published on: December 16, 2011
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Microstructured SiO/COP Stamps for Patterning TiO2 on Polymer Substrates via Microcontact Printing.
Cheng-Tse Wu1, Toru Utsunomiya1, Takashi Ichii1
1Department of Materials Science and Engineering, Kyoto University, Yoshida-Honmachi, Sakyo-ku, Kyoto 606-8501, Japan.
Langmuir : the ACS Journal of Surfaces and Colloids
|September 1, 2020
Summary
This study introduces novel cyclo-olefin polymer (COP) microcontact printing (μCP) stamps fabricated using vacuum ultraviolet (VUV) lithography. These master- and photoresist-free stamps enable efficient TiO2 micropatterning on flexible substrates.
Area of Science:
- Materials Science
- Microfabrication
- Surface Chemistry
Background:
- Microcontact printing (μCP) is crucial for microfabrication, but limitations exist with polydimethylsiloxane (PDMS) stamps.
- PDMS stamps are hydrophobic and soft, often requiring rigid masters or photoresist processes for replication.
Purpose of the Study:
- To develop a novel, master- and photoresist-free microcontact printing stamp.
- To demonstrate a facile and cost-effective method for creating micropatterns on flexible substrates.
Main Methods:
- Vacuum ultraviolet (VUV) lithography was used to create stamps from cyclo-olefin polymer (COP).
- Selective deposition of siloxane precursors followed by conversion to silicon dioxide (SiO2) formed hydrophilic patterns on COP.
- The resulting SiO2/COP stamps had punch heights of approximately 180 nm.
Main Results:
- A novel, hydrophilic SiO2/COP microcontact printing stamp was successfully fabricated.
- The stiffer SiO2/COP stamps demonstrated reduced deformation during pressing compared to PDMS.
- Titania precursor gel was patterned using μCP to produce TiO2 micropatterns on flexible substrates.
Conclusions:
- The developed SiO2/COP stamps offer a simple, cost-effective alternative for microfabrication.
- This technique facilitates the creation of micropatterned flexible devices.

