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Multi-level flash memory device based on stacked anisotropic ReS2-boron nitride-graphene heterostructures
Enxiu Wu1, Yuan Xie, Shijie Wang
1State Key Laboratory of Precision Measurement Technology and Instruments, School of Precision Instruments and Opto-electronics Engineering, Tianjin University, No. 92 Weijin Road, Tianjin, 300072, China. enxiuwu@tju.edu.cn xdhu@tju.edu.cn jingliu_1112@tju.edu.cn.
Nanoscale
|September 24, 2020
Summary
This study introduces a new ReS2-based memory device. It offers high performance for next-generation flash memories, including large memory windows and fast switching speeds.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Two-dimensional (2D) material heterostructures are promising for advanced memory devices.
- Current flash memories face limitations in size, capacity, speed, and power consumption.
Purpose of the Study:
- To develop a nonvolatile floating-gate memory device using a ReS2/boron nitride/graphene heterostructure.
- To evaluate the performance of this device for next-generation flash memory applications.
Main Methods:
- Fabrication of a heterostructure memory device incorporating ReS2.
- Characterization of the device's electrical properties, including memory window, current ratio, switching speed, endurance, and retention.
Main Results:
- The ReS2 memory device demonstrated a large memory window (>100 V) and an ultrahigh current ratio (>108).
- Achieved an ultrafast switching speed of 1 μs with hundreds of switching cycles and stable retention (~40% charge after 10 years).
- Utilized anisotropic electrical properties of ReS2 for direction-sensitive multi-level data storage, enhancing data density.
Conclusions:
- The ReS2 memory device shows significant potential for next-generation flash memories due to its scalability, capacity, speed, retention, and endurance.
- The device's unique properties may enable it to fulfill requirements across the entire memory device hierarchy.

