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Vibration Analysis of Post-Buckled Thin Film on Compliant Substrates

Xuanqing Fan1, Yi Wang2, Yuhang Li1,2

  • 1Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China.

Sensors (Basel, Switzerland)
|September 25, 2020
PubMed

Keywords:
elastic substrateflexible electronicsfree vibrationpost-bucklingthin film

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