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Related Experiment Video

Updated: Dec 6, 2025

Planar and Three-Dimensional Printing of Conductive Inks
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Planar and Three-Dimensional Printing of Conductive Inks

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High-performance printed electronics based on inorganic semiconducting nano to chip scale structures.

Abhishek Singh Dahiya1, Dhayalan Shakthivel1, Yogeenth Kumaresan1

  • 1Bendable Electronics and Sensing Technologies (BEST) Group, University of Glasgow, Glasgow, G12 8QQ, UK.

Nano Convergence
|October 9, 2020
PubMed
Summary

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Semiconductor manufacturing wastewater challenges and the potential solutions via printed electronics.

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Transparent and Transient Flexible Electronics.

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Site-Specific Growth and Printing of Nanowires for Resource Efficient Fabrication of Flexible Electronics.

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From Printed Devices to Vertically Stacked, 3D Flexible Hybrid Systems.

Advanced materials (Deerfield Beach, Fla.)·2025

Printed Electronics (PE) offers a revolutionary manufacturing approach. Inorganic semiconducting materials enable high-performance printed devices on flexible substrates, rivaling silicon-based electronics.

Area of Science:

  • Materials Science
  • Electronics Engineering
  • Manufacturing Technology

Background:

  • Printed Electronics (PE) is poised to transform electronics manufacturing.
  • Advances in flexible electronics and digital printing are key drivers.
  • Inorganic semiconducting materials offer a pathway to high-performance printed devices.

Purpose of the Study:

  • To review developments in inorganic semiconducting materials for high-performance large-area PE.
  • To survey Contact Printing (CP) and Transfer Printing (TP) technologies.
  • To discuss opportunities and challenges in industrial-scale PE manufacturing.

Main Methods:

  • Review of literature on inorganic semiconducting materials for PE.
  • Analysis of Contact Printing (CP) and Transfer Printing (TP) techniques.
Keywords:
Contact printingFlexible electronicsHigh-PerformanceLarge area electronicsNanomaterialsNanostructuresPrinted ElectronicsTransfer printingUltra-thin chips

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  • Examination of printed nano/micro/chip-scale structures (NWs, NRs, UTCs).

    • Main Results:

    • Inorganic semiconducting nano/micro/chip-scale structures demonstrate performance comparable to silicon-based electronics.
    • CP and TP enable large-area PE on unconventional substrates like plastic and paper.
    • Examples of printed electronic devices and circuits using NWs, NRs, and UTCs are presented.

    Conclusions:

    • High-performance large-area PE is achievable using inorganic semiconducting materials and printing technologies.
    • Opportunities exist for integrating functional materials into large areas and 3D layouts.
    • Technical challenges in high-throughput, industrial-scale manufacturing require viable solutions.