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From Printed Devices to Vertically Stacked, 3D Flexible Hybrid Systems.

Fengyuan Liu^1,2, Adamos Christou¹, Abhishek Singh Dahiya¹

¹Bendable Electronics and Sustainable Technologies (BEST) Group, Department of Electrical and Computer Engineering, Northeastern University, Boston, MA, 02115, USA.

Advanced Materials (Deerfield Beach, Fla.)

|January 31, 2025

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Printed electronics offer a flexible, resource-efficient alternative to silicon chips, enabling fast prototyping. Advances in high-resolution printing and materials are paving the way for high-performance printed integrated circuits.

Area of Science:

Materials Science
Electrical Engineering
Sustainable Manufacturing

Background:

Miniaturized silicon (Si) electronics have driven computing and communication advancements.
Emerging trends include printed, flexible, and stretchable electronics for large-area integration.
Printed electronics offer faster prototyping, reduced waste, and lower resource use compared to traditional Si manufacturing.

Purpose of the Study:

To review progress in printed electronics technologies.
To highlight emerging printing methods and their impact on resource efficiency and environmental footprint.
To explore novel functionalities enabled by vertical integration in printed electronics.

Main Methods:

Review of recent advances in high-resolution printing techniques.

Keywords:

3D integration green manufacturing heterogeneous integration printed and flexible electronics resource efficiency

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Analysis of high-mobility materials and device engineering for printed electronics.

Investigation of in-plane and out-of-plane integration strategies.

Main Results:

Significant progress in printed sensors and passive devices.
Printed circuits still face challenges in performance and integration density compared to Si.
Recent advances in printing resolution, materials, and device engineering show promise.

Conclusions:

Printed electronics offer a sustainable and resource-efficient pathway for future integrated circuits.
Vertical integration and advanced printing techniques are key to unlocking novel functionalities.
Further development is needed to match Si-based electronics in performance and integration density.