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Updated: Dec 5, 2025

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices
Published on: January 17, 2017
Adding an extra bonding layer (EBL) improved the bond strength of some universal adhesives (UAs) in etch-and-rinse and self-etch modes. However, the benefit of EBL varied among the tested UAs after aging.
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