Xenon Flash Lamp Lift-Off Technology without Laser for Flexible Electronics

Area of Science:

• Materials Science
• Manufacturing Engineering
• Thin Film Technology

Background:

• Traditional laser lift-off (LLO) methods face limitations in certain applications.
• Novel thin film transfer techniques are needed for advanced manufacturing.

Purpose of the Study:

• To investigate the process mechanisms and characteristics of xenon flash lamp lift-off (XF-LO) technology.
• To evaluate the effectiveness of XF-LO for releasing polyimide films.
• To compare XF-LO with existing laser lift-off (LLO) methods.

Main Methods:

• Experimental investigation of XF-LO using a light to heat conversion layer (LTHC) and xenon flash lamp (XFL).
• Testing on polyimide films with thicknesses ranging from 8.68 to 19.6 μm.
• Analysis using thermal gravimetric analysis (TGA), Fourier-transform infrared spectroscopy (FTIR), and transmittance analysis.

Main Results:

• Complete release of polyimide films was achieved at an XFL energy of 2.61 J/cm².
• Higher XFL energy intensities led to incomplete film release.
• Increased XFL energy degraded polyimide thermal durability, causing structural deformation and surface roughening.

Conclusions:

• XF-LO is a viable alternative to LLO for thin film transfer.
• An optimal XFL energy intensity of 2.61 J/cm² or less is crucial for successful XF-LO.
• This technology offers a promising approach for manufacturing flexible electronic boards.