Electrical Characterization of a Double-Layered Conductive Pattern with Different Crack Configurations for Durable...

Area of Science:

• Materials Science
• Electrical Engineering
• Textile Engineering

Background:

• Maintaining low electrical resistance in electronic textiles (e-textiles) during tensile deformation remains a significant challenge.
• Existing conductive patterns often fail or exhibit high resistance changes under strain.
• Crack configurations in conductive patterns critically influence their mechanical and electrical performance.

Purpose of the Study:

• To investigate a double-layered pattern design for improving the conductivity and durability of e-textiles under tensile stress.
• To analyze the effect of different crack configurations on the electrical resistance of e-textile patterns.
• To combine the beneficial properties of single and multiple crack growth patterns through a layered approach.

Main Methods:

• Theoretical design of double-layered patterns to control crack configurations.
• Fabrication of meandering copper patterns, silver ink patterns, and double-layered patterns on textiles.
• Characterization of resistance changes under single (large) and cyclic tensile deformations.

Main Results:

• Double-layered patterns demonstrated the lowest resistance under high elongation rates and cyclic loading.
• Meandering copper and silver ink patterns showed constant or monotonic resistance change rates.
• The resistance change rate of double-layered patterns varied significantly after electrical failure in the copper layer, but remained comparable to silver ink patterns.

Conclusions:

• Double-layered e-textile patterns offer superior performance in maintaining low electrical resistance under tensile deformation compared to single-layered designs.
• The proposed design effectively mitigates the drawbacks associated with single crack growth patterns.
• This approach provides a promising solution for durable and reliable conductive pathways in flexible electronics.