Failure and Recovery Modes of Submicron Cu(In,Ga)Se₂ Solar Cells with High Cu Content

As an emerging route to further lower the production cost, reducing the thickness of Cu(In,Ga)Se₂ (CIGS) absorber has drawn substantial attention and has been intensively studied in recent years. However, thickness-induced change still limits the device performance of thin CIGS solar cells. Herein, by examining a series of submicron CIGS solar cells with varied Cu content through their photovoltaic (PV) performance, the optimal Cu content in these submicron CIGS devices is found to be lower than that of the normal thickness CIGS devices. Electrical and compositional characterizations reveal that reduced thickness makes absorber vulnerable to the shunt paths formed with high Cu content. By intentionally lowering the Cu content in submicron CIGS, shunt resistance (R_sh) of the devices is significantly improved and therefore a high fill factor (FF) is achieved. Moreover, RbF postdeposition treatment (PDT) can passivate the shunt paths in the high Cu content samples to a very good extent, manifesting by the significantly improved FF.