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Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Kai-Kai Xu¹, Liang Zhang^1,2, Li-Li Gao³

¹School of Mechatronic Engineering, Jiangsu Normal University, Xuzhou, Jiangsu, China.

Science and Technology of Advanced Materials

|November 12, 2020

Abstract:

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and through-hole technology assemblies in IBM mainframe due to its unique low temperature characteristics. The review evaluates the effects of alloying elements, rare earth elements and nanoparticles on the wettability, microstructure, mechanical properties and oxidation resistance of the low-temperature solders.

Keywords:

103 Composites 308 Materials resources / recycling 503 TEM Low temperature solder SEM STEM mechanical properties microstructure oxidation resistance wettability

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