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Updated: Nov 30, 2025

Metal-Assisted Electrochemical Nanoimprinting of Porous and Solid Silicon Wafers
Published on: February 8, 2022
Atomic-Scale Imprinting by Sputter Deposition of Amorphous Metallic Films
Zheng Chen1, Amit Datye1, Georg H Simon1
1Department of Mechanical Engineering and Materials Science, Yale University, New Haven, Connecticut 06511, United States.
Abstract:
With its ease of implementation, low cost, high throughput, and excellent feature replication accuracy, nanoimprinting is used to fabricate structures for electrical, optical, and biological applications or to modify surface properties. If ultraprecise and/or subnanometer-sized patterns are desired, nanoimprinting has shown only limited success with polymers, silica glasses, or crystalline materials. In contrast, the absence of an intrinsic length scale that would interfere with imprinting resolution enables bulk metallic glasses (BMGs) to replicate structures down to the atomic scale through thermoplastic forming (TPF). However, only a small number of BMG-forming alloys can be used for TPF-based atomic-scale imprinting. Here, we demonstrate an alternative sputter deposition-based approach for the replication of atomic-scale features that is suited for a very broad range of amorphous alloys, thereby dramatically extending the available chemistries. Additional advantages are the method's scalability, its ability to replicate a wide range of molds, its low material consumption, and the fact that the films can readily be applied onto almost any workpiece, which together open up new avenues to atomically defined surface structuring and functionalization. Our method constitutes the advancement from proof of concept to a practical and highly versatile toolbox of atomic-scale imprinting to be explored for the science and technology of atomic-scale imprinting.

