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Heat diffusion imaging: In-plane thermal conductivity measurement of thin films in a broad temperature range
Tianhui Zhu1, David H Olson2, Patrick E Hopkins2
1Department of Electrical and Computer Engineering, University of Virginia, Charlottesville, Virginia 22904, USA.
The Review of Scientific Instruments
|December 2, 2020
Summary
This study introduces heat diffusion imaging, a novel method to measure thin film thermal conductivity without sample preparation. This technique accurately determines thermal properties across a wide temperature range.
Area of Science:
- Materials Science
- Thermal Physics
- Nanotechnology
Background:
- Accurate measurement of in-plane thermal conductivity in thin films is crucial for microelectronic device performance.
- Traditional methods often require complex sample preparation, such as film suspension or multiple thermometer depositions.
- Developing advanced characterization techniques is essential for understanding thermal transport at the nanoscale.
Purpose of the Study:
- To introduce and validate a new technique, heat diffusion imaging, for measuring the in-plane thermal conductivity of thin films.
- To demonstrate the capability of this method to perform measurements without requiring film suspension or multiple thermometer depositions.
- To assess the performance of heat diffusion imaging across a broad temperature range (40 K to 400 K).
Main Methods:
- Combined the heat spreader method with thermoreflectance imaging to create heat diffusion imaging.
- Utilized thermoreflectance imaging to generate a surface temperature distribution map.
- Analyzed the temperature decay profile to extract in-plane thermal conductivity.
- Integrated the system with a cryostat for variable temperature measurements.
Main Results:
- Successfully measured the in-plane thermal conductivity of silicon thin films using heat diffusion imaging.
- Demonstrated that the technique eliminates the need for film suspension or multiple thermometer depositions.
- Validated the results by comparing measurements with in-plane time-domain thermoreflectance and existing literature data.
- Confirmed the method's applicability across a temperature range from 40 K to 400 K.
Conclusions:
- Heat diffusion imaging is a viable and efficient technique for determining the in-plane thermal conductivity of thin films.
- This method offers a significant advantage by simplifying sample preparation requirements.
- The technique's accuracy and broad temperature applicability make it a valuable tool for materials characterization.
