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Screening Scheme Evaluation of the Assembly Process Based on the Stress-Strength Model and Defect Stream Analysis
Yubing Huang1, Wei Dai1, Lianxi Liu2
1School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China.
Entropy (Basel, Switzerland)
|December 3, 2020
Summary
This study introduces a stress-strength model to optimize product assembly screening. The method analyzes defect density variations to improve product quality and reduce risks.
Area of Science:
- Manufacturing Engineering
- Quality Control
- Reliability Engineering
Background:
- Assembly processes face variations in materials, parameters, and screening, impacting product quality.
- Existing methods may not fully account for defect dynamics under various stresses.
Purpose of the Study:
- To propose and evaluate a screening scheme method using a stress-strength model.
- To analyze defect density variations during assembly to enhance product quality.
Main Methods:
- Utilized a stress-strength model to analyze defect density variations.
- Performed defect stream analysis calculating residual defect density under multi-stress conditions.
- Calculated assembly task risk using entropy.
Main Results:
- Developed a probability density function that accurately models defect evolution from latent to dominant states.
- The proposed method aligns well with historical assembly data.
- Demonstrated the effectiveness of the screening scheme through product assembly analysis.
Conclusions:
- The stress-strength model provides an effective method for evaluating and optimizing assembly screening schemes.
- Understanding defect density dynamics and associated risks is crucial for improving manufacturing quality.
- The validated method can be applied to real-world product assembly processes.
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