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Method to eliminate thermal disturbance errors in digital image correlation measurement based on projection speckle
Applied Optics
|December 28, 2020
Summary
This study introduces a novel projection speckle method to eliminate thermal disturbance errors in high-temperature digital image correlation (DIC) measurements. The technique successfully separates and removes thermal effects, ensuring accurate material strain and displacement analysis.
Area of Science:
- Materials Science
- Optical Measurement
- Metrology
Background:
- Digital image correlation (DIC) is a vital optical technique for measuring material strain and displacement.
- High-temperature applications of DIC are increasingly common but suffer from significant thermal disturbance errors.
- Existing methods struggle to accurately compensate for thermal effects in DIC measurements.
Purpose of the Study:
- To develop and validate a new method for eliminating thermal disturbance in DIC measurements.
- To improve the accuracy of strain and displacement analysis in high-temperature environments.
- To enable reliable DIC measurements under challenging thermal conditions.
Main Methods:
- A projection speckle method was employed, applying distinct color information to the test piece surface.
- A color camera captured images, with channels separated for each frame.
- DIC calculations were performed on separated channels to isolate and remove thermal disturbance errors.
Main Results:
- The proposed method successfully separated real displacement from thermal disturbance.
- Experimental validation showed high consistency between corrected DIC results and true stage displacement.
- The feasibility and accuracy of the thermal disturbance elimination technique were confirmed.
Conclusions:
- The projection speckle method effectively eliminates thermal disturbance in DIC measurements.
- This technique significantly enhances the accuracy of high-temperature material analysis.
- The findings pave the way for more reliable DIC applications in extreme thermal environments.

