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Diffraction-based overlay metrology using angular-multiplexed acquisition of dark-field digital holograms.

Christos Messinis, Theodorus T M van Schaijk, Nitesh Pandey

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    Summary
    This summary is machine-generated.

    A new digital holographic microscopy technique improves optical overlay metrology for semiconductor manufacturing. This method enhances precision and reduces noise, paving the way for more accurate chip production.

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    Area of Science:

    • Semiconductor Device Manufacturing
    • Optical Metrology
    • Holographic Microscopy

    Background:

    • Optical overlay metrology is crucial for precise pattern placement in semiconductor manufacturing.
    • Shrinking device dimensions necessitate continuous improvements in overlay metrology precision.
    • Existing methods face challenges with noise and accuracy.

    Purpose of the Study:

    • To introduce and evaluate a novel off-axis dark-field digital holographic microscopy concept for overlay metrology.
    • To assess the impact of the new technique on noise reduction and measurement reproducibility.
    • To demonstrate the potential of digital holographic microscopy for future overlay metrology tools.

    Main Methods:

    • Utilizing an off-axis dark-field digital holographic microscopy setup.
    • Acquiring multiple holograms in parallel through angular multiplexing.
    • Testing the system on overlay targets with known programmed overlay values.

    Main Results:

    • Achieved overlay reproducibility of 0.13 nm.
    • Demonstrated good linearity with R²=0.9993 for programmed overlay values.
    • Showed reduced impact of source intensity fluctuations on overlay noise.

    Conclusions:

    • The novel digital holographic microscopy concept shows significant potential for improving overlay metrology.
    • The technique offers enhanced precision and noise reduction capabilities.
    • Digital holographic microscopy is a promising technology for next-generation semiconductor overlay metrology tools.