Recent progress in the development of thermal interface materials: a review

Yingyan Zhang1, Jun Ma2, Ning Wei3

  • 1School of Engineering, RMIT University, Bundoora, VIC 3083, Australia. yingyan.zhang@rmit.edu.au.

Summary

Advanced polymer nanocomposites with novel 1D, 2D, and 3D nanomaterials are crucial for efficient heat dissipation in modern electronics. This review explores their thermal conductivity and applications in thermal interface materials (TIMs).

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