Normal Strain under Axial Loading
Temperature Dependent Deformation
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Impact Loading
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Updated: Nov 21, 2025

A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens
Published on: June 2, 2017
F Ruebeling1,2, Y Xu3,4, G Richter5
1Institute for Applied Materials (IAM), Karlsruhe Institute of Technology (KIT), Kaiserstrasse 12, 76131 Karlsruhe, Germany.
The study reveals a dislocation trace line forms beneath sliding copper surfaces, influencing microstructure evolution. This phenomenon occurs across various loads and contact pressures, impacting tribological behavior.
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