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A simple model for viscoelastic crack propagation.

B N J Persson1

  • 1PGI-1, FZ Jülich, Jülich, EU, Germany. b.persson@fz-juelich.de.

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Summary
This summary is machine-generated.

Energy dissipation during crack propagation in viscoelastic solids can occur away from the crack tip. A simple theory shows good agreement with complex models, offering new insights into viscoelastic crack mechanics.

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Area of Science:

  • Materials Science
  • Solid Mechanics
  • Rheology

Background:

  • Crack propagation in viscoelastic materials involves energy dissipation.
  • Traditional theories often focus solely on the near crack tip region.
  • The stress field far from the crack tip can differ significantly from the expected singular form.

Purpose of the Study:

  • To investigate energy dissipation mechanisms during crack propagation in viscoelastic solids.
  • To compare a simplified crack propagation theory with one considering near crack tip stress fields.
  • To analyze energy dissipation in both opening and closing crack propagation modes.

Main Methods:

  • Development of a simplified theory for crack propagation energy.
  • Comparison of simplified theory predictions with a near crack tip stress field-based theory.
  • Experimental validation using adhesive interactions between silica glass and silicone rubber.

Main Results:

  • A simple crack propagation theory, neglecting near crack tip details, yields results in semiquantitative agreement with complex theories.
  • For closing crack propagation in viscoelastic solids, energy dissipation is shown to occur within the crack tip process zone.
  • Experimental data for silica glass and silicone rubber interactions support the theoretical findings.

Conclusions:

  • Simplified models can effectively estimate crack propagation energy in viscoelastic materials.
  • Understanding energy dissipation in the crack tip process zone is crucial for closing crack propagation.
  • The study provides a new perspective on viscoelastic crack mechanics with experimental validation.