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Preparation of Samples for Electron Microscopy01:20

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To be visualized by an electron microscope, either transmission or scanning, biological samples need to be fixed (stabilized) so the electron beam does not destroy them and dried thoroughly (desiccated/dehydrated) so the vacuum does not affect them. Fixation needs to be done as quickly as possible because the sample properties will start changing as soon as it is removed from its natural environment. For example, in a tissue sample, the oxygen levels begin decreasing, causing an altered...
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Applying microscopic analytic techniques for failure analysis in electronic assemblies.

Otto Grosshardt1, Boldizsár Árpád Nagy2, Anette Laetsch3

  • 1SC ZES Zollner Electronic SRL, 10 Parc Industrial Sud str, RO-440247, Satu-Mare, Romania. otto_grosshardt@zollner.de.

Applied Microscopy
|February 13, 2021
PubMed
Summary
This summary is machine-generated.

Microscopic analysis reveals common surface and internal failures in electronic assemblies. Techniques like optical microscopy and Fourier-Transform-Infrared (FTIR) microscopy aid in identifying these defects.

Keywords:
Cross-sectionFailure analysisOptical microscopyPrinted circuit boardsSEM-EDS

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Failure Analysis

Background:

  • Electronic assemblies are prone to various failures affecting performance and reliability.
  • Microscopic analysis is crucial for identifying subtle defects in electronic components.

Purpose of the Study:

  • To provide an overview of common surface, internal, and solder joint failures in electronic assemblies.
  • To present frequently observed internal and external nonconformities in electronic assemblies.

Main Methods:

  • Optical microscopy (stereomicroscopy) for surface documentation and failure localization.
  • Fourier-Transform-Infrared (FTIR) microscopy for surface analysis.
  • Metallographic cross-section analysis for internal defect examination.
  • Scanning Electron Microscopy with Energy Dispersive Spectrometry (SEM-EDS) for detailed analysis.

Main Results:

  • Identification of various surface defects and internal nonconformities through microscopic examination.
  • Localization of failures using optical and FTIR microscopy.
  • Characterization of internal structures and defects via cross-sectioning and SEM-EDS.

Conclusions:

  • Microscopic techniques are effective in detecting and characterizing failures in electronic assemblies.
  • A combination of analytical methods provides comprehensive failure analysis.
  • Understanding these nonconformities is key to improving electronic assembly reliability.