Measurement of effective wetting area at hydrophobic solid-liquid interface

The effective wetting area, a parameter somewhat different from the apparent contact area at solid-liquid interfaces, plays a significant role in surface wettability. However, determination of the effective wetting area for hydrophobic surfaces remains an open question. In the present study, we developed an electrochemical impedance method to evaluate the effective wetting area at a hydrophobic solid-liquid interface.

Patterned Si surfaces were prepared using the anisotropic wet etching method, and the water contact angle and electrochemical impedance were measured experimentally. The effective wetting area at the solid-liquid interface was examined based on the wettability and impedance results.

The electrochemical impedance for the patterned Si surfaces increased with increasing surface hydrophobicity, whereas the effective wetting area decreased. The intermediate wetting state (i.e. partial wetting model) was confirmed at the patterned Si surfaces, and the effective wetting area was theoretically estimated. The effective wetting area predicted from the electrochemical impedance agreed well with that predicted from the partial wetting model, thereby demonstrating the validity of the electrochemical impedance method for evaluating the effective wetting area at the hydrophobic solid-liquid interface.