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Microfluidic gasketless interconnects sealed by superhydrophobic surfaces.

Xiaoxiao Zhao1, Daniel S-W Park1, Steven A Soper2

  • 1Center for BioModular Multiscale Systems for Precision Medicine, Department of Mechanical and Industrial Engineering, Louisiana State University, Baton Rouge, LA 70803, USA.

Journal of Microelectromechanical Systems : a Joint IEEE and ASME Publication on Microstructures, Microactuators, Microsensors, and Microsystems
|March 22, 2021
PubMed
Summary

Novel gasketless superhydrophobic fluidic interconnects (GSFIs) offer rapid, leak-free sealing for microfluidic systems. This technology simplifies assembly and enhances fluid transport in complex modular devices.

Keywords:
Embedded MagnetsGasketlessInterconnectsPassive Alignment StructuresSuperhydrophobic Surfaces

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Area of Science:

  • Microfluidics
  • Materials Science
  • Surface Chemistry

Background:

  • Traditional microfluidic interconnects require complex assembly with components like O-rings and gaskets.
  • Manual expertise is often necessary for reliable sealing, increasing assembly time and cost.

Purpose of the Study:

  • To develop and evaluate novel gasketless superhydrophobic fluidic interconnects (GSFIs) for microfluidic applications.
  • To demonstrate rapid assembly and leak-free performance of these advanced interconnects.

Main Methods:

  • Fabrication of two test platforms: a multi-port chip system and a modules-on-a-motherboard system.
  • Utilizing transparent superhydrophobic surfaces to form liquid bridges for fluidic passages.
  • Employing embedded magnets and pin-in-V-groove structures for rapid assembly (under 3 seconds).
  • Conducting flow tests with various liquids (DI water, ethanol/water mixture, plasma) to assess leakage.

Main Results:

  • Successful demonstration of leak-free operation in both test platforms across tested flow rates and pressures.
  • The multi-port system maintained no leakage up to 100 µL/min.
  • The modules-on-a-motherboard system showed no water leakage at 20 µL/min and 3.71 psi.
  • Leakage pressure was found to decrease with liquids of lower surface tension.

Conclusions:

  • GSFIs provide a high-density, rapidly assembled, gasketless solution for microfluidic interconnects.
  • This technology facilitates efficient fluid transport in complex modular microfluidic systems.
  • The findings open new possibilities for advanced microfluidic device integration and functionality.