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Data Acquisition Protocol for Determining Embedded Sensitivity Functions

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CMUT-Based Sensor for Acoustic Emission Application: Experimental and Theoretical Contributions to Sensitivity

Redha Boubenia¹, Patrice Le Moal¹, Gilles Bourbon¹

¹Department of Applied Mechanics, CNRS/UFC/ENSMM/UTBM, FEMTO-ST Institute, University Bourgogne Franche-Comté, 25000 Besancon, France.

Sensors (Basel, Switzerland)

|April 3, 2021

Summary

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This study enhances capacitive micromachined ultrasonic transducer (CMUT) sensors for detecting acoustic emissions in damaged structures. Improvements in design, packaging, and signal processing significantly boosted the signal-to-noise ratio and sensor sensitivity.

Area of Science:

Materials Science and Engineering
Mechanical Engineering
Acoustics

Background:

Structural health monitoring relies on detecting acoustic emissions from damaged materials.
Capacitive micromachined ultrasonic transducers (CMUTs) offer a promising technology for acoustic emission sensing.
Optimizing CMUT sensor performance is crucial for reliable damage detection.

Purpose of the Study:

To improve the signal-to-noise ratio (SNR) and sensitivity of CMUT-based sensors for acoustic emission detection.
To investigate the impact of sensor design, packaging, electrical connections, and operating conditions on performance.
To analyze both acoustic-mechanical and mechanical-electrical sensitivity contributions.

Main Methods:

Development and electromechanical characterization of a CMUT-R100 sensor prototype.

Keywords:

acoustic impedance capacitive micromachined ultrasonic transducer characterization modeling sensitivity sensor

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Optimization of packaging, electrical connections, and signal processing techniques.

Experimental and numerical analysis of acoustic-mechanical coupling and mechanical-electrical conversion sensitivity.

Main Results:

The signal-to-noise ratio was increased from 17 dB to 37 dB through design and processing improvements.
Significant insertion losses (approx. 50%) were observed during acoustic testing of packaged vs. unpackaged chips.
Analytical models established the influence of geometrical parameters (e.g., air gap, thickness) and operating conditions (e.g., DC bias) on sensitivity.

Conclusions:

The study successfully enhanced CMUT sensor performance for acoustic emission detection.
Careful implementation of the silicon chip within its housing is critical to minimize acoustic-mechanical losses.
Design parameters and operating conditions offer clear pathways for maximizing CMUT sensor sensitivity.