CuO/PMMA Polymer Nanocomposites as Novel Resist Materials for E-Beam Lithography

Polymer nanocomposites have emerged as a new powerful class of materials because of their versatility, adaptability and wide applicability to a variety of fields. In this work, a facile and cost-effective method to develop poly(methyl methacrylate) (PMMA)-based polymer nanocomposites with copper oxide (CuO) nanofillers is presented. The study concentrates on finding an appropriate methodology to realize CuO/PMMA nanocomposites that could be used as resist materials for e-beam lithography (EBL) with the intention of being integrated into nanodevices. The CuO nanofillers were synthesized via a low-cost chemical synthesis, while several loadings, spin coating conditions and two solvents (acetone and methyl ethyl ketone) were explored and assessed with regards to their effect on producing CuO/PMMA nanocomposites. The nanocomposite films were patterned with EBL and contrast curve data and resolution analysis were used to evaluate their performance and suitability as a resist material. Micro-X-ray fluorescence spectroscopy (μ-XRF) complemented with XRF measurements via a handheld instrument (hh-XRF) was additionally employed as an alternative rapid and non-destructive technique in order to investigate the uniform dispersion of the nanofillers within the polymer matrix and to assist in the selection of the optimum preparation conditions. This study revealed that it is possible to produce low-cost CuO/PMMA nanocomposites as a novel resist material without resorting to complicated preparation techniques.