Highly Conductive Al/Al Interfaces in Ultrafine Grained Al Compact Prepared by Low Oxygen Powder Metallurgy Technique

The low oxygen powder metallurgy technique makes it possible to prepare full-dense ultrafine-grained (UFG) Al compacts with an average grain size of 160 nm by local surface bonding at a substantially lower temperature of 423 K from an Al nanopowder prepared by a low oxygen induction thermal plasma process. By atomic level analysis using transmission electron microscopy, it was found that there was almost no oxide layer at the Al/Al interfaces (grain boundaries) in UFG Al compact. The electrical conductivity of the UFG Al compact reached 3.5 × 10⁷ S/m, which is the same level as that of the cast Al bulk. The Vickers hardness of the UFG Al compact of 1078 MPa, which is 8 times that of the cast Al bulk, could be explained by the Hall-Petch law. In addition, fracture behavior was analyzed by conducting a small punch test. The as-sintered UFG Al compact initially fractured before reaching its ultimate strength due to its large number of grain boundaries with a high misorientation angle. Ultimate strength and elongation were enhanced to 175 MPa and 24%, respectively, by reduction of grain boundaries after annealing, indicating that high compatibility of strength and elongation can be realized by appropriate microstructure control.