Dasom Kim
3PUBLICATIONS
3CO-AUTHORS
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Publications (3)
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|Aug 07, 2021
Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State Sintering.Dasom Kim, Kyungju Kim, Hansang Kwon
|May 05, 2021
Highly Conductive Al/Al Interfaces in Ultrafine Grained Al Compact Prepared by Low Oxygen Powder Metallurgy Technique.Dasom Kim, Yusuke Hirayama, Zheng Liu
|Jan 12, 2021
Investigation of Formation Behaviour of Al-Cu Intermetallic Compounds in Al-50vol%Cu Composites Prepared by Spark Plasma Sintering under High Pressure.Dasom Kim, Kyungju Kim, Hansang Kwon
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