Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State...

Area of Science:

• Materials Science
• Metallurgy
• Composite Materials

Background:

• Aluminum-copper (Al-Cu) composites are gaining attention for their lightweight and thermal properties.
• Understanding Al/Cu interface interdiffusion is vital for enhancing thermal conductivity in these composites.

Purpose of the Study:

• To investigate the interdiffusion mechanism at Al/Cu interfaces.
• To correlate interdiffusion with process temperature in Al-50vol.%Cu composites.
• To analyze the resulting microstructural, mechanical, and thermal properties.

Main Methods:

• Preparation of Al-50vol.%Cu composite powder with encapsulated Cu particles.
• Solid-state sintering of the composite at temperatures ranging from 340 to 500 °C.
• Microstructural analysis (interdiffusion layer thickness), Vickers hardness testing, and thermal conductivity measurements.

Main Results:

• Formation of intermetallic compounds (ICs) like CuAl2 and Cu9Al4 at Al/Cu interfaces.
• Significant increase in interdiffusion layer thickness observed above 400 °C.
• Al-50vol.%Cu composite sintered at 380 °C exhibited a Vickers hardness of 79 HV and a thermal conductivity of 150 W∙m-1∙K-1.

Conclusions:

• Solid-state sintering at low temperatures (e.g., 380 °C) is effective for producing Al-Cu composites.
• Optimized Al/Cu interfaces contribute to superior mechanical strength and thermal conductivity.
• These composites offer a promising combination of properties for various applications.