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A Study of Nanosilver Colloid Prepared by Electrical Spark Discharge Method and Its Antifungal Control Benefits
Kuo-Hsiung Tseng1, Meng-Yun Chung1, Juei-Long Chiu1,2
1Department of Electrical Engineering, National Taipei University of Technology, Taipei 10608, Taiwan.
Abstract:
This is a study of an antimicrobial test, including yeast, Aspergillus Niger, and Aspergillus Flavus, on a nanosilver colloid solution. The antibiosis is compared with a standard silver ion solution at the same concentration as in the experimental process. This study proved that the nanosilver colloid prepared by the electrical spark discharge method (ESDM) is free of any chemical additives, has a microbial control effect, and that the effect is much better than the Ag+ standard solution at the same concentration. 3M Count Plate (YM) is used to test and observe the colony counts. The microbial control test for yeast, Aspergillus Niger, and Aspergillus Flavus is implemented in the nanosilver colloid. In addition to Aspergillus flavus, an Ag+ concentration of 16 ppm is enough to inhibit the growth of the samples. At the same concentration, the nanosilver colloid has a much better microbial control effect than the Ag+ standard solution, which may be because the nanoparticle can release Ag+ continuously, so the solution using the ESDM has a more significant microbial control effect.
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