Broadband Metallic Fiber-to-Chip Couplers and a Low-Complexity Integrated Plasmonic Platform

Andreas Messner1, Pascal A Jud1, Joel Winiger1

  • 1ETH Zurich, Institute of Electromagnetic Fields (IEF), 8092 Zürich, Switzerland.

Nano Letters
|May 19, 2021
PubMed

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