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Updated: Nov 4, 2025
A Novel Method for In Situ Electromechanical Characterization of Nanoscale Specimens
Published on: June 2, 2017
A novel method for in situ TEM measurements of adhesion at the diamond-metal interface
P A Loginov1, D A Sidorenko2, A S Orekhov2,3,4,5
1National University of Science and Technology MISIS, Leninskiy prospect, 4, Moscow, Russia, 119049. pavel.loginov.misis@list.ru.
Abstract:
The procedure for in situ TEM measurements of bonding strength (adhesion) between diamond and the metal matrix using a Hysitron PI 95 TEM Picoindenter holder for mechanical tests and Push-to-Pull devices was proposed. For tensile tests, dog-bone shaped lamellae 280-330 nm thick and ~ 2.5 µm long were used as objects of study. The lamellae were manufactured using the focused ion beam technology from the metal-diamond interface of diamond-containing composite material with a single-phase binder made of Fe-Co-Ni alloy. The experimentally determined bonding strength was 110 MPa.
