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Preparing and Applying Silver Nanoparticles in Conductive Ink and Inkjet Painting
Gui Bing Hong1, Yi Hua Luo1, Kai Jen Chuang2
1Department of Chemical Engineering and Biotechnology, National Taipei University of Technology, Taipei, 10608, Taiwan.
Journal of Nanoscience and Nanotechnology
|July 7, 2021
Summary
This study details the creation of stable, uniform silver nanoparticles using eco-friendly chemical reduction. The resulting conductive ink is suitable for inkjet printing on flexible substrates, achieving low electrical resistivity.
Area of Science:
- Materials Science
- Nanotechnology
- Chemistry
Background:
- Noble metal nanoparticles exhibit unique optical, electronic, and physicochemical properties.
- Inkjet printing offers advantages over traditional methods like spin coating, including material savings and faster production.
Purpose of the Study:
- To prepare uniform, stable silver nanoparticles using environmentally friendly agents.
- To develop a conductive silver ink for inkjet printing on PET flexible substrates at low sintering temperatures.
Main Methods:
- Silver nanoparticles were synthesized via chemical reduction, optimizing precursor, reducing agent, and stabilizer ratios.
- Characterization involved ultraviolet-visible spectrophotometry (UV-vis) and transmission electron microscopy (TEM).
- Conductive ink formulation included a sintering agent and surfactant for stable dispersion and low-temperature processing.
Main Results:
- The optimal ratio for precursor, reducing agent, and stabilizer was determined to be 1:6:1.
- Characterization confirmed single-shape, uniform-size, crystal-form, and monodisperse silver nanoparticles.
- Printed conductive silver ink treated with 70 mM NaCl solution achieved an electric resistivity of 5.17×10-4 Ω·cm.
Conclusions:
- Environmentally friendly synthesis yielded high-quality silver nanoparticles.
- The developed conductive ink demonstrates suitability for inkjet printing on flexible PET substrates.
- The achieved low resistivity indicates potential for applications requiring conductive patterns on flexible electronics.
