Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a high-angle grain boundary. An amount of 0.1% proof stress of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at a strain rate of 2.0 × 10^-1 s^-1. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on tensile strength is negligible at both 25 °C and 175 °C. The elongation of Sn-6.4Sb-3.9Ag decreases with an increase in the Ni addition volume at 25 °C according to the fracture mode change from ductile chisel point fracture to shear fracture. The effect of the addition of Ni into Sn-6.4Sb-3.9Ag on the elongation is negligible at 175 °C. The low cycle fatigue test result shows that the fatigue life does not degrade even at 175 °C in all alloys investigated. The fatigue life of Sn-6.4Sb-3.9Ag-0.4Ni (mass%) is superior to those of Sn-6.4Sb-3.9Ag and Sn-6.4Sb-3.9Ag-0.03Ni (mass%) in the high cycle fatigue area. The electron back scattering diffraction (EBSD) analysis result shows that fine recrystallized grains are generated at the cracked area in Sn-6.4Sb-3.9Ag-0.4Ni in the fatigue test at 175 °C, and the crack progresses in a complex manner at the grain boundaries.