Sealing and Bisection of Blood Vessels using a 1470 nm Laser: Optical, Thermal, and Tissue Damage Simulations

A 1470-nm laser previously demonstrated faster sealing and cutting of blood vessels with lower thermal spread than radiofrequency and ultrasonic surgical devices. This study simulates laser sealing and cutting of vessels in a sequential two-step process, for low (< 25 W), medium (~ 100 W), and high (200 W) power lasers. Optical transport, heat transfer, and tissue damage simulations were conducted. The blood vessel was assumed to be compressed to 400 μm thickness, matching previous experimental studies. A wide range of linear beam profiles (1-5 mm widths and 8-9.5 mm lengths), incident powers (20-200 W) and irradiation times (0.5-5.0 s), were simulated. Peak seal and cut temperatures and bifurcated thermal seal zones were also simulated and compared with experimental results for model validation. Optimal low power laser parameters were: 24W/5s/8×2mm for sealing and 24W/5s/8×1mm for cutting, yielding thermal spread of 0.4 mm and corresponding to experimental vessel burst pressures (BP) of ~450 mmHg. Optimal medium-power laser parameters were: 90 W/1s/9.5×3mm for sealing and 90W/1s/9.5×1mm for cutting, yielding thermal spread of 0.9 mm for BP of ~1300 mmHg. Optimal high-power laser parameters were: 200W/0.5s/9×3mm for sealing and 200W/0.5s/9×1mm for cutting, yielding thermal spread of 0.9 mm and extrapolated to have BP of ~1300 mmHg. All lasers produced seal zones between 0.4-1.5 mm, correlating to high BP of 300-1300 mmHg. Higher laser powers enable shorter sealing and cutting times and higher vessel seal strengths.