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A 27-Mbps, 0.08-mm3 CMOS Transceiver with Simultaneous Near-field Power Transmission and Data Telemetry for
Jordan Thimot1, Kukjoo Kim1, Chen Shi1
1Bioelectronic Systems Lab, Department of Electrical Engineering, Columbia University, New York NY.
Summary
This study presents a tiny, flexible CMOS transceiver for implantable systems, enabling high-speed, two-way data and power transmission wirelessly. It achieves 27 Mbps uplink and 6.6 kbps downlink through 1 mm of tissue.
Area of Science:
- Biomedical Engineering
- Electrical Engineering
- Microsystems Engineering
Background:
- Implantable systems require efficient wireless power and data transfer.
- Miniaturization and biocompatibility are critical challenges for implantable devices.
- Existing solutions often face limitations in data rates, power efficiency, or form factor.
Purpose of the Study:
- To develop a compact, inductively powered CMOS transceiver for implantable systems.
- To enable simultaneous two-way near-field data telemetry and power transmission.
- To achieve high data rates and efficient power transfer in a flexible, tissue-like form factor.
Main Methods:
- Designed a CMOS transceiver with integrated RF receiver coils.
- Utilized a four-coil inductive link operating at 27 MHz for power and 700 MHz for data.
- Implemented amplitude-shift-keying (ASK) for downlink and load-shift keying (LSK) backscattering for uplink.
- Employed post-processing to achieve a 15-µm chip thickness for flexibility.
Main Results:
- Achieved a 27 Mbps uplink and 6.6 kbps downlink data rate.
- Transceiver power consumption is 2.7 mW, supporting an additional 1.5 mW load.
- Demonstrated a 1.04% power transfer efficiency through 1 mm of tissue phantom.
- Integrated all necessary power harvesting and control circuitry within a minimal area.
Conclusions:
- The developed transceiver meets the requirements for advanced implantable systems.
- The flexible, miniaturized design facilitates seamless integration with biological tissues.
- This technology enables high-performance wireless communication and power for next-generation medical implants.

