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A Roadmap for Disruptive Applications and Heterogeneous Integration Using Two-Dimensional Materials: State-of-the-Art
Mayank Shrivastava1, V Ramgopal Rao2
1Department of Electronic Systems Engineering, Indian Institute of Science, Bangalore 560012, India.
Nano Letters
|August 3, 2021
Summary
This review outlines a roadmap for two-dimensional (2D) material microelectronics, enabling heterogeneous integration of diverse technologies like quantum computing and sensing on a single chip for disruptive applications.
Area of Science:
- Materials Science
- Microelectronics Engineering
- Semiconductor Technology
Background:
- Future microelectronics require heterogeneous integration of diverse functionalities.
- Two-dimensional (2D) materials offer unique properties for advanced semiconductor applications.
Purpose of the Study:
- To establish a roadmap for 2D material-based microelectronic technologies.
- To enable a universal technology platform for heterogeneous integration in the semiconductor industry.
Main Methods:
- Review of state-of-the-art 2D materials (graphene, transition metal dichalcogenides, phosphorene, hexagonal boron nitride).
- Analysis of their potential for futuristic applications.
- Discussion of technological and fundamental challenges.
Main Results:
- 2D materials provide unique possibilities for integrating classical, neuromorphic, and quantum computing, sensing, and memory.
- Identified key challenges and current standing in enabling a universal technology platform.
Conclusions:
- A universal technology platform based on 2D materials is crucial for disruptive microelectronic applications.
- Further research is needed to address technological and fundamental gaps for widespread adoption.
