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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
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High-Throughput Test Paves the Way for Machine-Learning-Based Optimization of Adhesives
Paul Roberts1, Joelle Frechette1,2
1Chemical and Biomolecular Engineering Department, Johns Hopkins University, Baltimore, Maryland 21218, United States.
ACS Central Science
|August 4, 2021
Summary
No abstract available in PubMed .

