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Temperature-Sensing Inks Using Electrohydrodynamic Inkjet Printing Technology.

Ju-Hun Ahn¹, Hee-Ju Hong², Chang-Yull Lee¹

¹Department of Aerospace Engineering, Inha University, Incheon 22212, Korea.

Materials (Basel, Switzerland)

|October 13, 2021

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Researchers developed a novel temperature-sensing ink for electrohydrodynamic (EHD) inkjet printing. This advancement enables precise temperature measurement on curved surfaces, crucial for advanced electronics and mechanical devices.

Area of Science:

Materials Science
Nanotechnology
Sensor Technology

Background:

Accurate temperature measurement is vital for thermal management in advanced mechanical and electronic systems.
Existing temperature sensors struggle to measure curved surfaces effectively.
Electrohydrodynamic (EHD) inkjet printing offers high resolution for flexible substrate applications.

Purpose of the Study:

To develop a novel temperature-sensing ink compatible with EHD inkjet printing.
To enable high-resolution temperature sensing on non-planar surfaces.
To overcome the limitations of conventional temperature sensors.

Main Methods:

A new temperature-sensing ink was synthesized and characterized.
Ink properties, particle arrangement, and resistance characteristics were analyzed.

Keywords:

EHD inkjet printing nanoceramic silver nanoparticle temperature sensor voltage

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EHD inkjet printing was employed to deposit the temperature-sensing ink.

Meniscus shapes and line widths were studied under various printing conditions.

Main Results:

The synthesized ink demonstrated suitable resistance characteristics for temperature sensing.
Particle analysis confirmed the ink's suitability for EHD inkjet printing.
Successful printing of the temperature-sensing ink on flexible substrates was achieved.
The printed sensors exhibited temperature-dependent resistance changes.

Conclusions:

The developed temperature-sensing ink is compatible with EHD inkjet printing technology.
This innovation facilitates the creation of flexible temperature sensors for curved surfaces.
The study confirms the potential for advanced thermal management in electronics and mechanics.