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Updated: Oct 17, 2025

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Parameter Optimization of Laser Direct-Write Patterning on Indium Tin Oxide/Polycarbonate Thin Films Using

Yi-Cheng Chen1, Yi-Kai Hsiung1, Chih-Yuan Chang1

  • 1Department of Mold and Die Engineering, National Kaohsiung University of Science and Technology, Kaohsiung 807618, Taiwan.

Materials (Basel, Switzerland)
|October 13, 2021
PubMed
Summary

Laser direct-write patterning of indium tin oxide (ITO) on polycarbonate (PC) creates isolation lines. Optimal parameters achieved precise patterning for electrical isolation of ITO films.

Keywords:
ITO thin filmTaguchi methodsanalysis of variancelaser direct-write

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Area of Science:

  • Materials Science
  • Surface Engineering
  • Laser Processing

Background:

  • Indium tin oxide (ITO) is a crucial transparent conductive material.
  • Patterning ITO films is essential for electronic device fabrication.
  • Laser direct-write (LDW) offers precise, non-contact patterning capabilities.

Purpose of the Study:

  • To investigate the effects of LDW parameters on ITO/PC patterning.
  • To optimize LDW parameters for creating effective isolation lines.
  • To achieve electrical isolation of ITO films on polycarbonate substrates.

Main Methods:

  • Utilized laser direct-write (LDW) technique for patterning ITO on PC.
  • Investigated the influence of power, pulse repetition rate, and defocusing distance.
  • Applied the Taguchi method for experimental design and parameter optimization.

Main Results:

  • Increased laser power widened isolation lines and reduced PC surface roughness.
  • Higher pulse repetition rate and defocusing distance decreased isolation line width.
  • Optimal parameters (5 W, 100 kHz, +3 mm) yielded a 48.4 μm line width and Ra 38 nm roughness.
  • Achieved confirmed electrical isolation of ITO films.

Conclusions:

  • LDW is effective for patterning ITO on PC substrates.
  • Parameter control is critical for achieving desired isolation line characteristics.
  • Optimized LDW process enables reliable electrical isolation for electronic applications.