Adsorption properties and recognition mechanisms of a novel surface imprinted polymer for selective removal of...

Cu(II)-citrate (Cu(II)-CA) complex, as one of the components in plating solutions, increases the difficulty of Cu(II) treatment due to its stable structure and high mobility. In this work, a novel surface imprinted polymer (Cu-CA-SIP) for selective removal of Cu(II)-CA complex from aqueous solution is synthesized by using polyethyleneimine (PEI) grafted onto chloromethylated polystyrene (CMP) microspheres. Cu(II)-CA anions are successfully imprinted with the molar ration of 1:1 by Cu-CA-SIP at initial pH 4.0. Nearly 100% removal rate can be achieved even at low Cu(II)-CA concentration (0.5 mmol/L), and the maximum Cu(II) uptake of Cu-CA-SIP reaches 1.38 mmol/g at 303 K. In Cu(II)/Fe(III)-CA, Cu(II)/Ni(II)-CA, Cu(II)/Zn(II)-CA and Cu(II)/Cd(II)-CA systems, the relative selectivity coefficients of Cu-CA-SIP for Cu(II)-CA are 9.66, 2.32, 1.40 and 44.55, respectively. Moreover, Cu-CA-SIP can be retrieved with negligible loss of adsorption capacity after six times of reuse. The Cu-CA-SIP column can effectively treat the actual electroplating wastewater within 114 BV, and can still reach 104 BV after three dynamic cycles. Therefore, an innovative imprinted material is designed for the first time on the basis of coordination-configuration recognition mechanism for the treatment of electroplating wastewater, providing a new insight in developing surface imprinted polymer in environmental remediation.