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Mechanisms of Heat Transfer II01:20

Mechanisms of Heat Transfer II

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In convection, thermal energy is carried by the large-scale flow of matter. Ocean currents and large-scale atmospheric circulation, which result from the buoyancy of warm air and water, transfer hot air from the tropics toward the poles and cold air from the poles toward the tropics. The Earth’s rotation interacts with those flows, causing the observed eastward flow of air in the temperate zones. Convection dominates heat transfer by air, and the amount of available space for the airflow...
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Just as interesting as the effects of heat transfer on a system are the methods by which the heat transfer occur. Whenever there is a temperature difference, heat transfer occurs. It may occur rapidly, such as through a cooking pan, or slowly, such as through the walls of a picnic ice box. So many processes involve heat transfer that it is hard to imagine a situation where no heat transfer occurs. Yet, every heat transfer takes place by only three methods: conduction, convection, and radiation.
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Heat transfer between the human body and its environment occurs through four main mechanisms: conduction, convection, radiation, and evaporation.
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Understanding heat transfer mechanisms is essential for understanding how our bodies maintain balance in different environmental conditions. When the environment is thermoneutral, the body is in a state of balance, neither using nor releasing energy to maintain its core temperature. However, when the environment is not thermoneutral, the body employs four heat transfer mechanisms to maintain homeostasis: conduction, convection, evaporation, and radiation. These mechanisms facilitate heat...
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Refrigerators or heat pumps are heat engines operating in a reverse direction. For a refrigerator, the focus is on removing heat from a specific area, whereas, for a heat pump, the focus is on dumping heat into one particular area. A refrigerator (or heat pump) absorbs heat Qc from the cold reservoir at Kelvin temperature Tc and discards heat Qh to the hot reservoir at Kelvin temperature Th, while work W is done on the engine’s working substance.
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When a substance—isolated from its environment—is subjected to heat changes, corresponding changes in temperature and phase of the substance is observed; this is graphically represented by heating and cooling curves.
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Recent Advances in Loop Heat Pipes with Flat Evaporator.

Pawel Szymanski1, Richard Law2, Ryan J. MᶜGlen3

  • 1Faculty of Mechanical Engineering and Ship Technology, Gdansk University of Technology, 80-233 Gdańsk, Poland.

Entropy (Basel, Switzerland)
|November 27, 2021
PubMed
Summary

This review covers advances in Loop Heat Pipes (LHP) with flat evaporators, addressing challenges like deformation and poor start-up. It explores solutions for improved thermal performance and miniaturization in electronics cooling.

Keywords:
capillary pressureflat evaporatorsloop heat pipenanofluidsporous structures

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Area of Science:

  • Thermal Engineering
  • Materials Science

Background:

  • Loop Heat Pipes (LHP) offer passive cooling but flat evaporators face implementation challenges.
  • Flat evaporators are ideal for discrete electronics but require solutions for issues like deformation, heat leak, and sealing.

Purpose of the Study:

  • To review current advances in Loop Heat Pipes (LHP) with flat evaporators.
  • To address challenges hindering the widespread adoption of flat-evaporator LHP technology.

Main Methods:

  • Review of novel manufacturing methods for LHPs.
  • Analysis of advanced LHP evaporator designs and working fluids.
  • Evaluation of construction materials for improved performance and reliability.

Main Results:

  • Identified solutions for evaporator deformation, heat leak, start-up performance, and sealing issues.
  • Demonstrated improvements in thermal performance, heat transfer distance, and reduced start-up time.
  • Explored advancements in miniaturization, weight reduction, and manufacturing cost.

Conclusions:

  • Flat-evaporator LHPs offer significant potential for passive cooling of electronic devices.
  • Addressing identified challenges through novel designs and materials is crucial for wider implementation.
  • Further research can optimize LHP performance for diverse electronic cooling applications.