Bonding performance of self-etch adhesives to enamel bleached with different peroxide concentrations

The aim of this study was to evaluate the micro-shear bond strength (µSBS) of one and two steps self-etch adhesive systems after enamel bleaching with photo-activated bleaching systems of different hydrogen peroxide (HP) concentration. Occlusal enamel of forty intact human molars were flattened and assigned into four groups. GI Unbleached, GII, GIII, and GIV were bleached with Pyrenees (3.5% HP), GC TiON (20% HP), and Hi-Lite (35% HP) respectively. Enamel treatment with one and two steps self-etch adhesives (Clearfil S3 Bond- S3, and Clearfil SE Bond-SE) then micro-tubes were fixed on enamel and filled with AP-X composite (n=5). Bond was tested with the universal testing machine. Data were analyzed using two-way ANOVA and Tukey's tests at 5 % level of significance. The µSBS was significantly different between adhesives (F=154.46; p<0.05) and bleaching systems (F=77.33; p<0.05) with significant interaction. Specimens bonded with S3 shows a significantly lower μSBS than those bonded with SE (p<0.05) in all groups. For both adhesives the bleached groups demonstrate lower µSBS than unbleached except specimens bleached with Pyrenees and bonded with SE (p>0.05). A significant difference was observed between groups of the bleaching systems (p<0.05). Different peroxide concentrations photo-activated bleaching systems adversely affect μSBS of one and two steps self-etch adhesives. Low concentration system (Pyrenees) does not influence the bond strength of two steps adhesive.