Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Label-Free Leukocyte Biophysical Profiling Using Impedance-Deformability Cytometry for Rapid Cardiovascular Risk Stratification.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)·2025
Same author

Morph and Function: Exploring Origami-Inspired Structures in Versatile Robotics Systems.

Micromachines·2025
Same author

Development of a Mass-Producible Microfluidic Device for Single and Bulk Mycobacteria Investigations.

Biosensors·2025
Same author

Microfluidic Gastrointestinal Cell Culture Technologies-Improvements in the Past Decade.

Biosensors·2024
Same author

Core-Shell Particles: From Fabrication Methods to Diverse Manipulation Techniques.

Micromachines·2023
Same author

Label-free microfluidic cell sorting and detection for rapid blood analysis.

Lab on a chip·2023

Related Experiment Video

Updated: Oct 9, 2025

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS
08:01

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS

Published on: June 17, 2017

12.5K

Realization of Three-Dimensionally MEMS Stacked Comb Structures for Microactuators Using Low-Temperature Multi-Wafer

Adrian J T Teo1, King Ho Holden Li1

  • 1School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore.

Micromachines
|December 24, 2021
PubMed
Summary
This summary is machine-generated.

This study presents a novel 3D stacked comb structure for micromirror applications using wafer bonding. The design achieves a large 70° tilt angle with high resonant frequency, enabling advanced microelectromechanical systems (MEMS).

Keywords:
3D MEMSCMOS–MEMS compatibilityalignment error correctionsmultiple wafer stackingwafer bonding

More Related Videos

Micro-masonry for 3D Additive Micromanufacturing
08:45

Micro-masonry for 3D Additive Micromanufacturing

Published on: August 1, 2014

10.5K
Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices
06:21

Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices

Published on: January 25, 2021

3.0K

Related Experiment Videos

Last Updated: Oct 9, 2025

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS
08:01

Fabrication of 3D Carbon Microelectromechanical Systems C-MEMS

Published on: June 17, 2017

12.5K
Micro-masonry for 3D Additive Micromanufacturing
08:45

Micro-masonry for 3D Additive Micromanufacturing

Published on: August 1, 2014

10.5K
Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices
06:21

Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices

Published on: January 25, 2021

3.0K

Area of Science:

  • Microelectromechanical Systems (MEMS)
  • Materials Science
  • Nanotechnology

Background:

  • Micromirror applications require precise, high-aspect-ratio structures.
  • Traditional fabrication methods can face misalignment issues and limitations in achieving desired mechanical properties.

Purpose of the Study:

  • To demonstrate a 3D stacked comb structure for micromirror applications.
  • To overcome misalignment challenges using vertically stacked designs.
  • To achieve larger tilt angles and high resonant frequencies for improved micromirror performance.

Main Methods:

  • Utilized CMOS-compatible wafer bonding technology.
  • Employed deep reactive ion etching (DRIE) for high-aspect-ratio silicon structures.
  • Minimized notching effects in silicon-on-insulator (SOI) wafers.
  • Implemented low-temperature fusion bonding to achieve high bond strength (2.5 J/m²).

Main Results:

  • Successfully fabricated a vertically stacked comb structure.
  • Achieved a large tilt angle of 70° with out-of-plane comb drives.
  • Measured a resonant frequency of 17.57 kHz under 2 V AC bias.
  • Demonstrated high bond strength sustaining subsequent processing.

Conclusions:

  • The developed 3D stacked comb structure is effective for micromirror applications.
  • The fabrication method offers a robust solution for misalignment issues.
  • Systematic study of resonant frequency provides design guidelines for future MEMS devices.