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Realization of Three-Dimensionally MEMS Stacked Comb Structures for Microactuators Using Low-Temperature Multi-Wafer
Adrian J T Teo1, King Ho Holden Li1
1School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore.
Micromachines
|December 24, 2021
Summary
This study presents a novel 3D stacked comb structure for micromirror applications using wafer bonding. The design achieves a large 70° tilt angle with high resonant frequency, enabling advanced microelectromechanical systems (MEMS).
Area of Science:
- Microelectromechanical Systems (MEMS)
- Materials Science
- Nanotechnology
Background:
- Micromirror applications require precise, high-aspect-ratio structures.
- Traditional fabrication methods can face misalignment issues and limitations in achieving desired mechanical properties.
Purpose of the Study:
- To demonstrate a 3D stacked comb structure for micromirror applications.
- To overcome misalignment challenges using vertically stacked designs.
- To achieve larger tilt angles and high resonant frequencies for improved micromirror performance.
Main Methods:
- Utilized CMOS-compatible wafer bonding technology.
- Employed deep reactive ion etching (DRIE) for high-aspect-ratio silicon structures.
- Minimized notching effects in silicon-on-insulator (SOI) wafers.
- Implemented low-temperature fusion bonding to achieve high bond strength (2.5 J/m²).
Main Results:
- Successfully fabricated a vertically stacked comb structure.
- Achieved a large tilt angle of 70° with out-of-plane comb drives.
- Measured a resonant frequency of 17.57 kHz under 2 V AC bias.
- Demonstrated high bond strength sustaining subsequent processing.
Conclusions:
- The developed 3D stacked comb structure is effective for micromirror applications.
- The fabrication method offers a robust solution for misalignment issues.
- Systematic study of resonant frequency provides design guidelines for future MEMS devices.
